In the semiconductor industry, product requirements are getting higher and higher, and processes and equipment are becoming more and more complex. The control of process parameters is also stricter, and the requirements for materials are also correspondingly improved. The problems encountered in the production process are becoming more and more complicated, and are not caused by a single factor, but are usually related to multiple potential factors. This speech takes the wire sway issue of a BGA product in the mold process as an example, applies JMP tools to analyze data to find out the root cause, and finds the most suitable model through model comparison to optimize and find the optimal value, and finally solves the problem.
