William Entley, Senior R&D Manager, EMD Electronics
Jed Campbell, Sr. Systems Engineer, JMP Statistical Discovery
Jennifer Achtyl, Lead R&D Scientist, EMD Electronics
Robert Ridgeway, Senior R&D Manager, EMD Electronics
Plasma enhanced chemical vapor deposition (PECVD) is extensively used to deposit thin films in semiconductor manufacturing. PECVD processes are gas phase processes typically conducted at low pressures in specially designed deposition chambers. Many process parameters influence the thin film properties in ways that are difficult to characterize.
This presentation shows:
- How the Generalized Regression platform was used to "rescue" a definitive screening design that had runs that couldn’t be completed.
- How the original design was augmented.
- How this complex design space was finally understood well enough to find a new precursor, effectively identifying a thin film that maximized the targeted film property (high mechanical strength) in the fewest number of experiments.
This presentation is predominantly hands-on, using JMP in real time.
