Automated analysis of data from a thermal test bench for microelectronic packages
Integrated circuits generate a flow of heat during their operation, but their performance is degraded if their
operating temperature exceeds a certain threshold. Thermal problems of microelectronic packages
are therefore at the center of the concerns of packaging specialists. They use test benches to
to measure the thermal resistances of different assembly solutions.
Following the installation of a new thermal test bench, we set up an automated analysis of
“.csv” files (>500) by JMP. The script filters and transforms the data. Then allows the user to explore and
visualize the data thanks to the interactive interface of the "Graph Builder" (heat maps...), but also to approach
statistical identification of variations. Finally an automatic report is published. This reduced the time for
data preparation and analysis so that more time can be spent interpreting the results and
innovation to satisfy our customers.
