Speakers:
Li Mingjie, Shenzhen Saiyifa Microelectronics Co., Ltd. System Operations Manager, Power Facilities Department
Sun Wentao, Quality Engineer, Quality Department, Shenzhen Saifa Microelectronics Co., Ltd.
the speech topic : Wire width optimization of wire bonding points for silicon carbide aluminum wire products
Summary of speech:
Li Mingjie is mainly responsible for the operation and maintenance of pure water, wastewater, air conditioning, and exhaust systems of power facilities. He is also the person in charge of tool and technology promotion in the development of the company's lean culture. He is responsible for the company's Six Sigma black belt project and the promotion of JMP data analysis applications. Sun Wentao is currently the quality engineer of the quality department. In this speech, the two guests will jointly share a wonderful project case of how to optimize and improve the line width of the lead bonding point of silicon carbide aluminum wire products through the standard six sigma method based on JMP.
