Speakers: Zhang Hanmin, Head of Wire Bonding Process, Sigma Manager, Black Belt Master, NXP Semiconductors (China)
the speech topic : How to apply JMP analysis to solve problems in the semiconductor industry
Speech abstract:
In the semiconductor industry, product requirements are getting higher and higher, and processes and equipment are becoming more and more complex. The control of process parameters is also stricter, and the requirements for materials are correspondingly increased. The problems encountered in the production process are becoming more and more complex, and are not caused by a single factor, but are usually related to multiple potential factors. In this speech, a BGA product has a wire sway issue study in the Mold process as an example. The JMP tool is used to analyze the data to find the root cause, and the model comparison model is used to find the most suitable model to optimize and find the optimal value, and finally solve it. Problem.
